12.17.2025

Data Center Cooling with DOWFROST™ Heat Transfer Fluids

Data Center Cooling with DOWFROST™ Heat Transfer Fluids

As power densities continue to grow in AI data centers, better cooling systems are no longer optional; they are essential. Glycol-water solutions offer many benefits to keep your data center cool. 

The two major challenges today are keeping the chips cool and keeping the air inside the facility cool. DOWFROST™ LC 25 and DOWFROST™ HD are the solutions that help alleviate those problems. Here is how these products make a difference: 

Rack Cooling: 

DOWFROST™ LC 25 is the optimal fluid for efficient heat removal in Datacom Equipment Cooling Systems (DECS) and Coolant Distribution Units (CDUs) located within server racks. Removing the heat generated by the chips is a critical step in the process, especially as AI-driven workloads push processors to run hotter and denser than ever before. 

Direct-to-chip cooling relies on a closed, carefully controlled loop of fluid that circulates through cold plates mounted directly on CPUs, GPUs, and memory modules. This loop requires a coolant that delivers high thermal performance, low viscosity, and corrosion protection across a wide range of flow rates and temperatures. 

DOWFROST™ LC 25 is engineered specifically for these conditions. Its propylene glycol-water blend provides excellent heat transfer characteristics while protecting copper, stainless steel, and other metals commonly found in cold plate assemblies. The inhibitor package helps extend equipment life, reduce maintenance, and maintain the purity needed for sensitive components. This ensures highly efficient heat extraction at the rack, keeping chip temperatures stable and maximizing performance. 

Facility Cooling: 

While chip-level cooling manages the hottest part of the system, the heat still needs to be removed from the building. That’s where the facility cooling loop plays an equally essential role. 

Chilled glycol can be used to reject heat absorbed from the technical cooling loop via the CDU that is connected to the greater facility cooling system. Because this piping often extends throughout the facility, it needs freeze protection, corrosion control, and long-term stability. 

DOWFROST™ HD is the ideal solution for this larger-scale loop. Formulated with a heavy-duty corrosion inhibitor package, DOWFROST™ HD protects carbon steel, cast iron, aluminum, and other metals found in mechanical systems. Its freeze protection properties allow facility operators to lower energy costs and improve overall efficiency. 

By maintaining consistent thermal performance across the entire HVAC and heat-rejection network, DOWFROST™ HD ensures the data center environment remains within recommended operating temperature ranges. 

DOWFROST™ LC 25 delivers the precision, stability, and protection required for direct-to-chip cooling, while DOWFROST™ HD supports the larger facility loop with dependable freeze protection and long-term corrosion control. Together, these fluids help ensure that heat is efficiently removed from the chips and safely rejected from the building, creating a cooling architecture that is resilient, energy efficient, and ready for the future of high-performance data processing. 

If you need support selecting the right glycol solution for your data center or evaluating system requirements, Lentus is here to help with expert guidance, quality products, and dependable service. To get more information on our full heat transfer fluid line, visit our website or call 270-765-2212.  

Get in touch