The Leading Fluid Solution for Direct-to-Chip Liquid Cooling
As demand for AI-ready infrastructure accelerates, data centers are increasingly adopting liquid cooling to meet rising thermal demands. Technologies like direct-to-chip that were once niche solutions are now mission-critical. DOWFROST™ LC 25 is the leading PG25 solution for liquid cooling that delivers long-lasting, reliable thermal performance.
- High Thermal Efficiency
- Corrosion Inhibitor Package
- Long Fluid Lifetime
- Easy Deployment
Why DOWFROST™ LC 25
Engineered for High Thermal Demands
DOWFROST™ LC 25 is a heat transfer fluid engineered for direct-to-chip liquid cooling in high-performance data centers. Backed by Dow’s first-to-market expertise, it delivers consistent thermal performance and long-term protection for mission-critical infrastructure.
Thermal Stability
Advanced Protection
Long Fluid Lifetime
Superior Quality
Day One Ready
Material Compatibility
Technical Support
Dyed Fluorescent Yellow
Sustainability
Direct-to-Chip Cooling + DOWFROST™ LC 25 is the Sustainable Choice
As chip power densities continue to rise, direct-to-chip cooling can handle much higher thermal loads than traditional air cooling. Beyond its increased thermal capacity, these systems offer multiple sustainability benefits:
- Supports higher efficiency vs. air cooling
- Can reduce total facility energy by over 25%
- Helps reduce strain on water-stressed regions
Performance Delivered
Eliminate the supply chain as a point of failure. As Dow’s trusted distribution partner, Lentus delivers DOWFROST™ LC 25 on time, at scale, and with quality assured from source to site.
Future-Proof Your Data Center