Built for High Thermal Demands
With AI and other high-performance workloads driving demand, direct-to-chip liquid cooling is becoming the new standard, and the strategic partnership of Dow and Lentus leads the way.
- High Thermal Efficiency
- Corrosion Inhibitor Package
- Long Fluid Lifetime
- Easy Deployment


The Future is Heating Up
DOWFROST™ LC 25 is a heat transfer fluid engineered for direct-to-chip liquid cooling in high-performance data centers. Backed by Dow’s first-to-market expertise, it delivers consistent thermal performance and long-term protection for mission-critical infrastructure. Download the white paper to see how DOWFROST™ LC 25 and Lentus deliver the cooling advantage your data center needs to stay ahead.
Long Fluid Lifetime
Supported by Dow’s Technical Team
Robust Corrosion Inhibitor Package
Minimal Maintenance Required
SPECIALLY FORMULATED AND READY-TO-USE PROPYLENE GLYCOL
Compatible
Performance Delivered
Uptime is everything, and you need suppliers who won’t slow you down. Lentus delivers. As a trusted distribution partner of Dow, Lentus ensures that DOWFROST™ LC 25 arrives on time, on spec, and ready to perform, with quality protected from source to site.




Ready to Move?
